Optical Glass Wafer Single-Side Grinding and Polishing Machine

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Shenzhen Ponda Grinding Technology Co.,Ltd.

VIP   Audited Supplier 5 years
Profile Certified by SGS/BV
FD-460XL
12months
12months
Surface Grinding Machine
Flat Workpieces
Grinding Wheel
PLC
Semiautomatic
Surface Grinding Machine
High Precision
ISO 9001
New
Electricity
Grinding Disc
with Variable Speed
Metal and Non-Metal
Φ460 mm / 24 Inches
Oversea Setup & After-Sale Avalaible
Single Plate
3
Pneumatic or Weight Block
Slurry
850kg
PONDA
Wood Crate
China
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
High precision grinding machine equipment principle:
1. The grinding machine is a precision grinding and polishing equipment. The grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure is applied to the workpiece, and the workpiece and the grinding disc are subjected to relative running friction to achieve the purpose of grinding and polishing.
2. The disc repairing machine uses the hydraulic suspended guide rail to move back and forth, and the diamond shaving knife trims the grinding disc precisely, so that the grinding disc gets precise flatn
ess.
High precision grinding machine features:
1, frequency conversion control, soft start, soft stop, small impact, reduce workpiece damage.
2, using the timing function to control the time, processing products can be set in advance on the panel time and speed, working time jump to the set time, the machine automatically stops working, can better control the size of the product.
3, grinding machine workpiece pressure using weight weight pressure, polishing workpiece surface brightness, no scratch, no scratch, no grain, no pitting, no edge, high flatness characteristics. After polishing the workpiece surface roughness can reach Ra0.002;
4, the use of interval automatic spray device, can freely set the spray interval time, the grinding liquid can be evenly sprayed on the grinding disc, to achieve the stability of the workpiece. Reduce the grinding time, save the cost of consumables, but also meet the requirements of the environment.
5, the use of imported bearings, motors, to ensure the stability and life of the equipment, to ensure the precision requirements of the workpiece.

 
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plates, light spinner joint valves, hydraulic tight, stainless steel, and other materials single-sided grinding, polishing.
 grinding disc flatness can reach ±0.002mm; The flatness of the workpiece with a diameter of 50mm can reach 1/4 wavelength. The flatness of the workpiece after processing can reach ±0.0005mm.

 


SPECIFICATION
Standard Specification
Machine ModelFD3803FD4603FD6103FD9104
Plate DiameterΦ380 mm / 15 inchesΦ460mm / 18 inchesΦ610mm / 24 inchesΦ910mm / 36 inches
Max. Workpiece Diameter
(without conditioning ring)
Φ180 mmΦ220 mmΦ270 mmΦ420 mm
Conditioning Ring DiameterΦ180 mmΦ220 mmΦ270 mmΦ420 mm
Number of Station3334
Plate Rotate Speed0-140 rpm0-140 rpm0-120 rpm0-90 rpm
Facing & Grooving Speed
(Not include in Polishing)
0-120 mm/m0-120 mm/m0-120 mm/m0-120 mm/m
Total Weight450 kg850 kg1000 kg1600 kg
Total Floor Space670×940 mm1030×730 mm1920×840 mm2100×1300 mm
Built-In Optional Kits
GradeStandardUpgradedAdvanced
ControlsDigitalDigitalTouch-Screen PLC
Pressure SourceHand Weight BlockPneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System-ManualDigital, Manual
Cylinder Bar Drive System-ManualIntegrated with PLC
Conditioning Ring Drive System-ManualIntegrated with PLC
Machine Enclosure-Framed by Aluminum AlloyFramed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION 


Company profile

Factory front desk

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its supporting products and consumable materials

Patent
Delivery & Packing
Packing Details  : Packing, 1 pcs/Wooden box.
Ceramic Chip High Speed Precise Lapping Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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