PE Foam Blister Tray for Electronic Components

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Min Order 5000 Sets
Availability In Stock
Shipping From Guangdong, China
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Dongguan Hongzhida Excellent New Materials. Co., Ltd.

VIP   Audited Supplier 5 years
Profile Certified by SGS/BV
DieCutting-003
Electronic Product, Food, Hardware
Plastic
Recyclable
PE
Black
50kg/M3
Black or White
N/A
Carton Box
400x300x2mm
Dongguan, China
3901100090
Product Description
PE Foam Blister Tray for Electronic Components
IXPE foam is physically cross-linked using an E-Beam (electronic beam) process that eliminates the need for harsh chemicals to achieve the advantages of crosslinking.
It is vertically foamed to create a balanced expansion and smooth surfaces on both sides, which are free of the irregular bubble surface common with chemically crosslinked foam. E-Beam crosslinking creates superior cellular structure combined with consistently uniform gauge and density. This leads to more predictable application performance
. Our featured foams are able to be supplied in rolls, sheets, blocks or profile cut to meet your demands.


Featured advantages
• Non-toxic and odor-free
• Oil & grease resistant 
• Mosisture proofing and shock absorption
• Suitability for thermo-forming and thermo-molding

 

IXPE foam specifications

 Product name: PE foam blister tray
 Materials: LDPE
 Density: 50kg/m3 (30pcf)
 Thickness: 2.0mm   
 Width: 1000mm, 1200mm, 1500mm
 Length: Optional
 Optional service: Cutting and slitting
 Supplied Form: In rolls or sheets

IXPE foam physical properties
Property / Testing StandardUnitIXPE-010IXPE-015
Density / GBT6343kg/m3100±1065±5
Tensile strength / GBT10808MPa1.3/0.90.8/0.6
Tear strength / GBT6344N/cm45/6033/41
Thermal conductivity / GBT3399W/m.K0.0520.050
Water absorption / GBT8810mg/cm20.030.04
Working temperaturedegreeFrom -80 to +120

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