Audited Supplier
Tpcm 588 is a thin bondline, high-performance TIM whose interface with minimal thermal contact resistance, designed for high end thermal management applications. At temperatures above its transition temperature of 50°C,Tpcm 580 begins to soften and flow, for which it minimizes migration (pump-out) ,filling the microscopic irregularities of the components it comes into contact with. It's reliabilitable for this material to apply, demonstrated though exposure to 1000 hours of various aging tests resulting in proven dependability at an operating temperature of 125°C.Tpcm 580 is inherently tacky, flexible and exceptionally easy-to-use. Tpcm 580 can be supplied as cut parts in strips and rolls with top tabbed liners for easy application. The top tabbed liner can be removed immediately or provide a protective cover during shipping and removed at assembly.
Features and benefits:
• Naturally tacky for adhesion during assembly and transport
• Fully characterized long term reliability
• No pump out
• Easy rework
Dongguan City U.ONE Electronic Technology Co., Ltd. was officially established in 2009. It is a professional enterprise in China that integrates research and development, agency, processing, production, and sales of thermal conductivity, conductivity, and insulation products. The company has a production and research base of approximately 3000 square meters, located at No. 20 Nonglin Road, Long bei Ling Village, Tangxia town, Dongguan city, Guangdong province, China. Adhering to the business philosophy of "service first, quality first, and reasonable prices", the company has established long-term cooperative relationships with multiple enterprises across the country.
Mainly product: thermal pad, thermal grease,phase change material ,mylar ,silicone rubber sheet, foam, ,silicone products,etc. Products can provide customized services, including customized sizes, customized label,customized packaging, for customers to choose.
| Environment: |
| Major parters: |
Welcome to private message communication.
