Professional Reverse Enigineer Prodiving 8 Layers PCB Printed Circuit Board Schematic Diagram PCB Layout Design PCB Assembly PCBA

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Shenzhen Jingxin Electronic Technology Co., Ltd.

VIP   Audited Supplier 4 years
Profile Certified by SGS/BV
PCBA For Medical
Rigid Circuit Board
FR-4
Fiberglass Epoxy
V2
Rigid
Electrolytic Foil
Copper
Organic Resin
FR-4
Jxpcba
8 Layers
Green
White
Enig
Used for Medical Equipment
IATF16949
ISO9001
ISO14001
Customer's brand
Carton Box
500 PCS/CTN
China
8534009000
Product Description
Product Description
Specification:
PCB layers:
1-24layers
PCB materials:
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:
620*1100mm
PCB certificate:
RoHS Directive-Compliant
PCB Thickness:
1.6 ±0.1mm
Out Layer Copper Thickness:
0.5-5oz
Inner Layer Copper Thickness:
0.5-4oz
PCB max. board thickness:
6.0mm
Minimum Hole Size:
0.20mm
Minimum Line Width/Space:
3/3mil
Min. S/M Pitch:
0.1mm(4mil)
Plate Thickness and Aperture Ratio :
30:1
Minimum Hole Copper:
20µm
Hole Dia. Tolerance(PTH):
±0.075mm(3mil)
Hole dia. Tolerance(NPTH):
±0.05mm (2mil)
Hole Position Deviation:
±0.05mm (2mil)
Outline Tolerance:
±0.05mm (2mil)
PCB surface finished:
HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
PCB solder mask:
Black, white, yellow
Legend:
White 
E-test:
100% AOI, X-ray, Flying probe test.
Outline:
Rout and Score/V-cut
Inspection Standard:
IPC-A-610CCLASSII
Certificates:
UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:
Final Inspection, E-test, Solderability Test, Micro Section and More
PCB Assembly OEM Service
Electronic Components Material Purchasing
Bare PCB Fabrication
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service
PCB Assembly Service: SMT, BGA, DIP
PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT)
Conformal Coating Service
Prototyping and Mass Production
PCBA ODM service
PCB Layout, PCBA Design According To Your Idea
PCBA Copy/Clone
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
Embedded User Interface Design / lSystem Hardware Design







 

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