Audited Supplier
HDITC50T300M
0.5
20
1.25
10*10(mm)
Product Description
Product description:
50 MHz to 1 GHz Drop In Isolator
Custom Design:
Mounting instructions for microstrip Components:
Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.
(2): Unilateral assembly gap of components should be <0.05mm.
50 MHz to 1 GHz Drop In Isolator
Custom Design:
Applications:
Wireless Communication Base Station
Radar System
RF Circuit
Microwave Radio Systems
T/R Module
GPS
Cavity Filter
Public Address System Radio Transmitter
Satellite TV
Mounting instructions for microstrip Components:
Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :
- Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
- Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.
(2): Unilateral assembly gap of components should be <0.05mm.
