Silicon Wafer Back Grinding Wheel Diamond Wheel Factory Direct Supplying Wheel

Price $2500.00 Compare
Min Order 1 pieces
Availability In Stock
Shipping From Henan, China
Popularity 318 people viewed
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Zhengzhou Hongtuo Precision Tools Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
HT-1
Imported Diamond Abrasive
Deburring, Ferrous Metals
Customized
80#---1000#
Cylindrical
1 Years
7 Days/24 Hours
Long Life
Cubic Boron Carbide
OEM, ODM
Vitrified & Resin
Diamond Grinding Wheel
Wooden Box
Angle Grinding Wheels
Vitrified & Resin
Steel
HT
Wooden Boxes
Henan, China
Product Description

grinding wheel

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing
blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles,
aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other
industries.
 
Silicon Wafer Back Grinding Wheels
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:

1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name
Silicon Wafer Back  grinding wheel
OEM
Supported
Advantage
Good performance
Size
Customized
Bond
CBN&Diamond
Grit size
Customized
OED
Supported
Package
Woonden box & cartoon box
 
 
 
 
 
 
 
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