

grinding wheel
blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles,
aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other
industries.
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name | Silicon Wafer Back grinding wheel | OEM | Supported |
Advantage | Good performance | Size | Customized |
Bond | CBN&Diamond | Grit size | Customized |
OED | Supported | Package | Woonden box & cartoon box |









