Smart Circuit Board Design for Advanced Custom Electronics Manufacturing Solutions

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Hangzhou Fonieto Technology Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
  • Zhejiang, China
  • Xie Hao (Mr.)  
FONIETO-1
Tin
SMT
1-22 Layers
FR-4
RoHS, CCC, ISO
Customized
New
Green;Red;Yellow;Black;White
No Limited
Retangular, Round, Slots, Cutouts, Complex, Irreg
HASL, Gold Finger, OSP, Enig, Peelable Mask
OEM, ODM
Inner Vacuum Packing Outer Carton Box
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
China
8534009000
Product Description
PCBA Production Capacity: Step into the future of technology and craftsmanship with our unparalleled Printed Circuit Board Assembly (PCBA) production capabilities. Our ultra-modern, state-of-the-art facilities are meticulously designed to meet the diverse needs of various industries, providing unmatched innovation and personalized solutions. We promise precision, unwavering reliability, and optimal efficiency in every custom circuit board solution we offer. Every product is meticulously crafted to not only meet but significantly surpass your expectations for exceptional quality and outstanding performance.
Delivery timeSamples5pcs ~ 100pcs1 DayAll the above time starts after all components and PCB materials are ready
Small batch101pcs ~ 5000 pcs3 Days
Medium batch5001pcs ~ 10000 pcs5 Days
Large batch>10001pcs15 Days
Production capacitySMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day
Component RangeMin. 01005(0.4mm*0.2mm)
Max. 55mm(H25mm)
PCB SizeMin. 50mm*50mm (Suggest >100mm*100mm) Max. 460mm*1200mm
Max. ThicknessThe batch size is not more than 3 mm, and the model is unlimited
Placement Accuracy+/- 40 micrometer (Chip)  +/- 30 micrometer (IC)
PCB TypesPCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB
File FormatBill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files
Solder paste tin wire tin barLead-free solder paste, customed solder paste, Brand solder paste
Steel MeshLaser stencil IC and BGA components can reach PC-2 Class
Component PackagingWe accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk.
Component Purchase Service1 Foundry only (Customers provide PCB components)                                                                               
2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us)                                                                                               3 A full set of substitute materials (reduce purchase cost and communication cost)
Test1IQC: ncoming inspection.
2 IPQC: In-production inspection.
3 Visual QC: regular quality inspection.
4 On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity.
5 X-Ray: Check BGA, QFN and other high-precision hidden PAD components.
6 Test function and performance according to customer's test procedures and steps.
7 Aging test: According to the customer's test time for aging.



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