Audited Supplier
AM-TP001
GS, RoHS, CE, ISO9001
Blue Grey
High Temperature
Waterproof
Metal
Silica Gel
Silicone
Die Cut Tape
Thermal Conductive Pad
Blue,Gray,White,Pink,Green or Custom
0.5mm 1mm 1.5mm 2mm 2.5mm
200*400mm or Custom
Freely
Heat Sink,Insulation
1W-8W or Custom
AIMO
Custom Package
Customized Size/die cutting
China
3919909090
Product Description
Thermal Grizzly Minus Pad 8 For Notebooks RAM VRM Gamestations
Thermal silica pad
Silicone Thermal pad is specially designed for the purpose of high performance thermal conductivity. Pad standard size 400mm*200mm
According to customer needs to cut the shapes. Basic thickness 0.3mm/0.5mm/1mm/1.5mm/2mm/3mm, special size and thickness can be
customized. The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer's requirement.
Product color is mass production, if need special color can be adjusted to the actual situation,please check all TDS as following:
PROPERTIES | UNITS | AM12 | AM15 | AM20 | AM25 | AM30 | TEST METHOD |
Color | / | White Grey | White Grey | Grey | Orange | Blue | Visual |
Thermal impedance @1mm/20Psi | ºCin2/W | 0.8 | 0.7 | 0.5 | 0.47 | 0.42 | ASTM D5470 |
Specific Gravity | g/cm3 | 1.8 | 2 | 2.4 | 2.9 | 3 | ASTM D792 |
Volume Resistivity | ΩCM | 5.0×1013Ω | 5.0×1013Ω | 2.6×1013Ω | 1.5×1013Ω | 1.0×1014Ω | ASTM D257 |
Thermal Conductivity | W/mk | 1.2 | 1.5 | 2 | 2.5 | 3 | ASTM D5470 |
Breakdown Voltage | KV/mm | >=10 | >=10 | >=10 | >=10 | >=9 | ASTM D149 |
Dielectric Constant@1MHz | @1MHz | 5.5 | 5.5 | 6 | 5.5 | 5.6 | ASTM D150 |
Thickness (±10%) | mm | 0.2~10 | 0.2~10 | 0.2~10 | 0.3~5.0 | 0.3~5.0 | ASTM D374 |
Hardness | Shore 00 | 35/50 | 35/50 | 35/50 | 35/50 | 35/50 | ASTM D2240 |
Flammability class | / | UL94-VO | UL94-VO | UL94-VO | UL94-VO | UL94-VO | UL94 |
Application temperature | ºC | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | *** |
Tape Choose | / | ∨ | ∨ | ∨ | ∨ | ∨ | *** |
Self-adhesive | / | Double sided | Double sided | Double sided | Double sided | Double sided | *** |
Fiber Strengthen | / | ∨ | ∨ | ∨ | ∨ | ∨ | *** |
PROPERTIES | UNITS | AM40 | AM50 | AM60 | AM80 | TEST METHOD |
Color | / | Brown | Dark Red | Light Grey | Grey | Visual |
Thermal impedance @1mm/20Psi | ºCin2/W | 0.36 | 0.21 | 0.2 | 0.15 | ASTM D5470 |
Specific Gravity | g/cm3 | 2.8 | 3 | 3.2 | 3.4 | ASTM D792 |
Volume Resistivity | ΩCM | 1.0×1014Ω | 1.0×1014Ω | 1.0×1013Ω | 1.0×1013Ω | ASTM D257 |
Thermal Conductivity | W/mk | 4 | 5 | 6.5 | 8 | ASTM D5470 |
Breakdown Voltage | KV/mm | >=9 | >=10 | >=10 | >=8 | ASTM D149 |
Dielectric Constant@1MHz | @1MHz | 5 | 5 | 5 | 7.5 | ASTM D150 |
Thickness (±10%) | mm | 0.5 ~5.0 | 0.5 ~5.0 | 0.5 ~5.0 | 0.5 ~5.0 | ASTM D374 |
Hardness | Shore 00 | 50 | 55 | 60 | 70±10 | ASTM D2240 |
Flammability class | / | UL94-VO | UL94-VO | UL94-VO | UL94-VO | UL94 |
Application temperature | ºC | -50~+200 | -50~+200 | -50~+200 | -40~+150 | *** |
Tape Choose | / | ∨ | ∨ | ∨ | ∨ | *** |
Self-adhesive | / | Double sided | Double sided | Double sided | Double sided | *** |
Fiber Strengthen | / | ∨ | ∨ | ∨ | ∨ | *** |
Typical Application of Thermal Conductive Pad Includes
- Flat panel display - Handheld devices
- Memory modules
- PDP display
*The main packing of our products is ordinary packing,including plastic wrap, carton and pallet clamp.
*We also can accept your request to pack the adhesive tape with custom logo and package ship to Amazon FBA,Ebay!
1). Can you send me free samples ?
Yes ,we can send you free samples for standard size .
2). How long will it take to made our product ?
Delivery time within 5~10 workingdays.
3). How to guarantee your quality?
Before production, send samples for testing,after passing the test arrange production.
From the production to the packaging process has QC strict inspection, so you never worry about quality.
4). Can you print our logo or do special packaging?
We can print custmer's logo on the tape and paper cpre and cartons.
We can do any special packaging as required such as individual shrink with logo card, barcode lable, blister card or any request.
