Type 4 T4 Type 6 T6 Best Lead Free Surface Mount Liquid Tin Solder Paste for Soldering

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Min Order 30 kg
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Shipping From Guangdong, China
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Foshan Xi Feng Tin Products Co., Ltd.

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Lead Free Solder Paste
Tin
SMT
Double-Layer
FR-4
ISO
Customized
New
Lead Free
Type 3: 25 to 45 Microns
Type 4: 20 to 38 Microns
No Clean Flux
Sac305 Sn96.5AG3.0cu0.5
Sac0307 Sn99AG0.3cu0.7
Sn42bi58 Low Temperature
RoHS
Jar
Syringe
Courier / Air Freight
6months
0 to 10 Degree Celsius
SMT
SMD
XF Solder
Foam Box
100g to 1000g
China
3810100000
Product Description
Type 4 T4 Type 6 T6 Best Lead Free Surface Mount Liquid Tin Solder Paste for Soldering
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Applications of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
This solder paste SAC305 is primarily used for electronics manufacturing by surface mount technology (SMT) and through-hole soldering. Including:

Consumer Electronics: It finds application in the production of consumer electronics such as refrigerators, smartphones, tablets, laptops, and gaming devices.

Automotive Electronics: The solder paste is suitable for soldering critical components in automotive electronics systems.

How to use the Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305?
Stencil Printing: Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).

Place SMD components: Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.

Conduct the Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.

Instruction on Storage and Using of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.

It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.

Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
 
 
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