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Audited Supplier
2 Years
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Stable and Reliable Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power
$
1000000.00
MOQ:1 Piece
Vertical Electric Furnace 5g Ceramic Filter High-Temperature Box Furnace
$
200000.00
MOQ:1 Piece
MLC600 Maskless Lithography System Aligner Machine with 3D Structure Lithography Capability
$
1000000.00
MOQ:1 Piece
High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine
$
0.00
MOQ:1 Piece
Direct Imaging Lithography Machine with Advanced Air Float Platform Technology
$
1000000.00
MOQ:1 Piece
Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting
$
0.00
MOQ:1 Piece
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