$1560.00
1 Cubic Meters (MOQ)
Dense Alumina 40X40 Cell 150X150X300mm Honeycomb Ceramic Substrate for Rto, Rco
Jiangxi Kexing Special Ceramic Co., Ltd.
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Alumina / Aluminum Nitride / Silicon Nitride Directed Plated Copper Dpc Substrate
| Price | $10.00 |
|---|---|
| Min Order | 1 pieces |
| Availability | In Stock |
| Shipping From | Fujian, China |
| Popularity | 310 people viewed |
Model NO.:
INC-DBC20310
Application:
Aerospace, Electronics, Medical, Vacuum Brazing
Compressive Strength:
2300MPa
Coating Thickness:
8-30μm
Coating Layer:
Mo/Mn
Plated Layer:
Nickel/Copper/Gold
Thermal Conductivity:
25W/(M.K)
Plating Thickness:
2-9μm
Max. Use Temperature:
1600ºC
Density:
3.7g/cm3
Type:
Insulating Ceramics
Trademark:
INNOVACERA
Transport Package:
Carton Packing
Specification:
Customized
Origin:
Fujian, China
Product Description
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high-temperature eutectic melting process and thus tightly and firmly joined to the ceramic. DBC Ceramic Substrate Key Features: Ceramic metallized: Ti/W, gold(Au), silver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit Coating: 0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized Directed Plated Copper Substrate Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6. Flip-chip/eutectic substrate 7. Sensor ceramic substrate In future, the DBC ceramic substrates market will develop rapidly, driven by the demand from IGBT, automobile, CPV, aerospace and communication. The electric vehicles market will drive the DBC ceramic substrates to increase in the next ten years. | ||||||||
Aluminium Nitride Material Properties | ||||||||
Properties | INC-AN180 | INC-AN200 | INC-AN220 | |||||
Color | Gray | Gray | Beige | |||||
Main Content | 96%ALN | 96%ALN | 97%ALN | |||||
Main Characteristics | High Thermal Conductivity,Excellent Plasma Resistance | |||||||
Main Applications | Heat Dissipating Parts,Plasma Resistance Parts | |||||||
Bulk Density | 3.30 | 3.30 | 3.28 | |||||
Water Absorption | 0.00 | 0.00 | 0.00 | |||||
Vickers Hardness(Load 500g) | 10.00 | 9.50 | 9.00 | |||||
Flexural Strength | >=350 | >=325 | >=280 | |||||
Compressive Strength | 2,500.00 | 2,500.00 | - | |||||
Young' Modulus of Elasticity | 320.00 | 320.00 | 320.00 | |||||
Poisson's Ratio | 0.24 | 0.24 | 0.24 | |||||
Fracture Toughness | - | - | - | |||||
Coefficient Linear Thermal Expansion | 40-400 degree Celsius | 4.80 | 4.60 | 4.50 | ||||
Thermal Conductivity | 20 degree Celsius | 180.00 | 200.00 | 220.00 | ||||
Specific Heat | 0.74 | 0.74 | 0.76 | |||||
Thermal Shocking Resistance | - | - | - | |||||
Volume Resistivity | 20 degree Celsius | >=10-14 | >=10-14 | >=10-13 | ||||
Dielectric Strength | >=15 | >=15 | >=15 | |||||
Dielectric Constant | 1MHz | 9.00 | 8.80 | 8.60 | ||||
Loss Tangent | *10-4 | 5.00 | 5.00 | 6.00 | ||||
Remark: The value is just for review, different using conditions will have a little difference. | ||||||||
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