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BGA Rework Station

Price $2599.00
Min Order 1 Piece
Availability In Stock
Shipping From Beijing, China
Popularity 508 people viewed
Model NO.:
bga160
Type:
Soldering Station
Structure:
Platform
Rotaion Speed:
0.3-3rpm
Max Eccentricity Distance:
250mm
Tilting Angle:
0-135°
Voltage:
220V
Welding Turning Rolls Type:
Adjustable
Condition:
New
Max Mounting BGA Siz:
≤ 20mm X20mm
Min Mounting BGA Size:
3.5× 3.5mm
Power:
200W
Power Supply:
220V, 50Hz
Net Weight:
15kg
Dimension:
400 * 550 * 430mm
Trademark:
Torch
Transport Package:
Wooden Case
Specification:
400 * 550 * 430mm
Origin:
Beijing, China
HS Code:
8514200009
Product Description
Desoldering worktable BGA900-IR 




Introduction:
   The desoldering worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair wilding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX (including graphics chip, video card etc).

Features of BGA900:
  1. Double infrared ray heating systems, can heating at the top of the components and the bottom of PCB at the same time, compared with the Cyclones, the heating process is more stable and avoid uneven heating of the PCB which can cause warp; the use of advanced infrared heating methods needn't replace the heating nozzle, this also save the cost of investment.
  2. Advanced temperature system: Independent heating from top to bottom and also independent temperature control, welding finished with the alarm function, all this characteristics can be more convenient and comfortable.
  3. Fashionable appearance: black full design, arc top heater, small size, and could be placed in a 400MM room.
  4. Chip oriention: Red laser BGA chips center orientation is easy to operate.
  5. Large area heating and preheating system: Top heating 80×80MM,bottom heating 200×200MM. It could be easy to deal with heavy thermal capacity PCB and other lead-free soldering.
  6. Integrative design: All-purpose orientation bracket and PING could achieve sustainment and fixation of big size PCB. So, it is easy to prevent and rectify some transformable mainboard, to fix up the PCB board and ensure the success of maintainment.
  7. Economical investment: Fully considered the reality of common maintain department, not only cut off the cost, but also ensure the quality.
  8. More users: small cubage, large warm-up area, very suit to computer mainboard, notebook PC, and individual maintain department. It is convenient to transport and convey.
Specification:
Specification
Heatinfrared heating from top and bottom
DimensionL400mm * W350mm * H410mm
WeightAbout 15kg
BracketIt is decided by customers' request.
PackingIt is decided by customers' request.
Packed weight About 17kg
Electric parameters
Input powerAC 220V 50Hz
Top heatIR heating 
Top heating size80mm* 80mm
Top heating power300W
Bottom heatingIR heating
Bottom heating size200mm* 200mm
Bottom heating power600W
Total power900W
Temperature controlling
top heating controllingTemperature controlling independently, high precision close loop controlling, error of the panel is 0.5%
top temperature measurementHigh sensitive K temperature sensor, monitoring temperature directly
Bottom heating controllingTemperature controlling independently, high precision close loop controlling, error of the panel is 0.5%, with alarm.
Bottom temperature measurementHigh sensitive K temperature sensor, monitoring temperature directly
Repairing function
ApplicationFor soldering, unsoldering, repairing BGA QFP CSP and semi conductors. 
 
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