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Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA

Price Negotiable
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
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Model NO.:
DA1201FC
After-sales Service:
Provided
Condition:
New
Speed:
High Speed
Precision:
High Precision
Certification:
RoHS, ISO, CE
Warranty:
12 Months
Automatic Grade:
Automatic
Product Name:
Semiconductor Equipment
Feature 1:
High Precision
Feature 2:
High Efficiency
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Product Description

 

  • DA1201FC Flip Chip and Die Attach

    X/Y placement accuracy:

    Flip-chip/high-precision die attach mode: ±10-15μm@3σ;

    Die attach mode: ±10-25μm@3σ;

    Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic high-speed flip chip solution for various devices, such as SOIC, SO, QFN, BGA, LGA, etc. At the same time, it is equipped with die attach system;

    High-speed and high precision die bonding capability;

    MS Windows® operating system and flexible connectivity;

    Flip chip and die bonding in one machine - the conversion between the two processes is simple and easy;

    Comprehensive inspection system;

    High density lead frame handling capability.

 

 
 ItemDA1201FC
Flip Chip/
High Precision
Die Attach Module		X/Y placement accuracy±10-15μm @3o
Theta placement accuracy5mm≤Diesize≤10mm ±0.15°@3o;1mm≤Diesize≤5mm ±0.3°@3o;
0.25mm≤Diesize≤1mm ±1°@3o
Die Attach Modulex/Y placement accuracy±10-25μm @3o
Theta placement accuracyDie size≥1mm ±0.5°@3o;
Die size≤1mm ±1°@3o
Materials
Handling
Capability		Die size0.15x0.15mm-6x6mm
Substrate dimensionsLength:100-300mm;width:40-100mm;
Thickness:0.1-0.8mm(Standard)0.8-2.0mm (Optional)
Magazine dimensions110-310mmx20-110mmx70-153mm(LengthxWidthx Height
Wafer SystemWafer size6"-12"
Auto-theta alignment±10°Range
Theta360°
Bond Head SystemBond force20-1000 g(Programmable
Pattern
Recognition
System		PR systemMulti-color
Resolution1280pixelx640 pixel(Customizable)
Pixel&FOV±1/4pixel  (±lum@FOV2mm)
Angular accuracy0 . 1°
Dimensions&WeightDimension2250x1650×1750 mm(LengthxWidthxHeight)
Weight1600kg
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.

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