Audited Supplier
- DA1201FC Flip Chip and Die Attach
X/Y placement accuracy:
Flip-chip/high-precision die attach mode: ±10-15μm@3σ;
Die attach mode: ±10-25μm@3σ;
Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic high-speed flip chip solution for various devices, such as SOIC, SO, QFN, BGA, LGA, etc. At the same time, it is equipped with die attach system;
High-speed and high precision die bonding capability;
MS Windows® operating system and flexible connectivity;
Flip chip and die bonding in one machine - the conversion between the two processes is simple and easy;
Comprehensive inspection system;
High density lead frame handling capability.
| Item | DA1201FC | |
| Flip Chip/ High Precision Die Attach Module | X/Y placement accuracy | ±10-15μm @3o |
| Theta placement accuracy | 5mm≤Diesize≤10mm ±0.15°@3o;1mm≤Diesize≤5mm ±0.3°@3o; 0.25mm≤Diesize≤1mm ±1°@3o | |
| Die Attach Module | x/Y placement accuracy | ±10-25μm @3o |
| Theta placement accuracy | Die size≥1mm ±0.5°@3o; Die size≤1mm ±1°@3o | |
| Materials Handling Capability | Die size | 0.15x0.15mm-6x6mm |
| Substrate dimensions | Length:100-300mm;width:40-100mm; Thickness:0.1-0.8mm(Standard)0.8-2.0mm (Optional) | |
| Magazine dimensions | 110-310mmx20-110mmx70-153mm(LengthxWidthx Height | |
| Wafer System | Wafer size | 6"-12" |
| Auto-theta alignment | ±10°Range | |
| Theta | 360° | |
| Bond Head System | Bond force | 20-1000 g(Programmable |
| Pattern Recognition System | PR system | Multi-color |
| Resolution | 1280pixelx640 pixel(Customizable) | |
| Pixel&FOV | ±1/4pixel (±lum@FOV2mm) | |
| Angular accuracy | 0 . 1° | |
| Dimensions&Weight | Dimension | 2250x1650×1750 mm(LengthxWidthxHeight) |
| Weight | 1600kg |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
