Fiber Laser Engraving Machine Laser for Marking of Curved Surface, Relief, Irregular Product
| Price | $7000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 383 people viewed |
2, Fiber output, it is flexible to apply, the system is easy to make 3D processing
3, Good beam quality, TEM00 single-module output, after collimating diameter is 10mm, M2<1.8, divergence angle of beam is 0.24mrad
| Model | YLP-MDF-152 |
| Laser output power | 20 / 30 / 50W |
| Beam quality M2 | <1.3 |
| Marking area | 160x160mm |
| Working distance | 197±2mm |
| Max surface height difference | ±20mm |
| Min. character size | 0.5mm |
| Pulse Repetion | 1 |
| Cooling method | Air cooling |
| Power consumption | 0.5KW |
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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