Fiber Laser Engraving Machine Laser for Marking of Curved Surface, Relief, Irregular Product

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Shipping From Jiangsu, China
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Jiangsu Himalaya Semiconductor Co., Ltd.

VIP   Audited Supplier 4 years
Profile Certified by SGS/BV
  • Jiangsu, China
  • Jack (Mr.)  
    Deputy General Manager
YLP-MDF-152
Provided
Provided
Visible
Metal
Fiber Laser
Semiconductor Laser
Fiber Laser Marking
Guaranteed Quality
Customized According to Needs
Provided
Himalaya
Customized or Wooden Box Packaging
Standard Specifications
China
Product Description
 
Product Description
Brief Description
The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch industry, jewelry industry, mould industry etc.
Features:
1, Small and compact in size, air cooling
2, Fiber output, it is flexible to apply, the system is easy to make 3D processing
3, Good beam quality, TEM00 single-module output, after collimating diameter is 10mm, M2<1.8, divergence angle of beam is 0.24mrad
Specification:
ModelYLP-MDF-152
Laser output power20 / 30 / 50W
Beam quality M2<1.3
Marking area160x160mm
Working distance197±2mm
Max surface height difference±20mm
Min. character size0.5mm
Pulse Repetion1
Cooling methodAir cooling 
Power consumption0.5KW
 
 
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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