Audited Supplier
Mainly used in the final process of surface mount semiconductor device production, it can automatically complete the electrical parameter testing, classification and selection storage, laser printing identification, identification detection, external dimension detection, and final tape packaging output of the device
High speed device processing: with an output of up to 12K+@<150ms
High speed turret imported direct drive rotary torque (DDR) motor system with 24 suction nozzles
Independent up/down driving device, promoting high-speed action of the up/down suction nozzle
Modular design: convenient for adjustment and maintenance, and the positions of various functional components can be quickly replaced
High compatibility: suitable for various feeding and discharging methods, such as bulk, tube, etc
MTBA ≥ 60 minutes
MTBF>220 hours
Device direction detection
Printing detection
Pin/3D5s detection
Device in band detection
24 suction nozzles
Basic 2 test benches, maximum of 8
Pressure contact and clamp type in contact mode
Loading method tube installation (vibrating disc)
Unloading method: tube loading (loose material, reel)
Divide BIN boxes into basic 4Bin boxes or 8Bin boxes (option)
1 cleaning box
1 litter box (option)
Equipment size (excluding signal tower) 2350mm * 1400mm * 1900mm (length * width * height)
Voltage 220VAC (single-phase)
Frequency 50/60Hz
Power consumption 3.5KW
Compressed air 5~7 bar
Working environment temperature: 20-30 ºC
Humidity: 30-70% relative humidity
Maximum weight 1T
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
