Audited Supplier
Can be paired with 2 process chambers and 8 baking units
(configurable AD unit), suitable for small batchesProcess testing and production line for mass production. Land occupation
Small area, capable of transporting wafers up and down through robots
The process can be completed automatically.
Can be paired with 4 process chambers and 18 baking sheetsYuan (configurable AD unit), suitable for batch
Quantity production line. Transferring wafers through robots
Under production, the production capacity can reach 190WPH. Land occupation
Small, stable, easy to operate and maintain.
Can be paired with 6 process chambers and 24 baking units(configurable AD unit), suitable for ultra thick adhesive
Coating, development, and baking processes, widely used in
Advanced packaging field, 8-12 inch wafer processing.
The production capacity can reach 110WPH, among which the process unit is special
Special design avoids wafer drawing phenomenon and stacking structure
The construction occupies a small area and has high production capacity. Can meet the needs of the factory
Automation requirements
By using three robots to transport the upper and lower chips of the wafer, it can be connected to the lithography machine (inline) for front processing
Road 4-6 inch wafers with a technology node of 180 nanometers or higher. It combines user-friendly operation and functionality
The flexible configuration of art supports widespread application in mass production.
1. The three-dimensional intersection structure, combined with software algorithms, improves equipment production capacity.
2. The shared arm structure reduces the occupied space and improves process consistency.
3. Adopting high-precision metering photoresist pump and multi-stage suction valve to save adhesive amount and avoid pollution.
4. Independently developed high-precision hot plate with 7-zone control, using power control.
5. The robotic arm comes with a positioning function to improve efficiency and stability.
6. Supports mainstream lithography machine interfaces.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
