Audited Supplier
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.
2.Fiber output, can apply flexibly, and easy to make 3D processing system.
3.Install backward reflecting isolator, which uses the particularity of wavelength and direction of laser, and the special structure inside the backward reflecting isolator, to block the laser reflected by work piece, in order to avoid the laser enter the laser oscillator again to damage the laser oscillator.
Specification:
| Model | G20 | |
| Laser output power | 20W | |
| Focus lens | F160 (standard) F254(optional) | |
| Lens type | F160 (standard) | F254(optional) |
| Marking area | 3.9''×3.9'' | 6.3''×6.3'' |
| Marking speed | 300 characters/sec, height=0.039'' | 300 characters/sec, height=0.039'' |
| Min. character size | 0.01'' | 0.02'' |
| Min. line width | 50μm | 90μm |
| Wave length | 1064nm | |
| Beam quality M2 | <1.6 | |
| Power stability(8h) | <±1% rms | |
| Pulse repetition frequency | 1.6kHz-1000kHz | |
| Marking depth | ≤0.016'' | |
| Marking speed | ≤22.97'/s | |
| Repetition accuracy | ±0.0001'' | |
| Power consumption | 500W | |
| Indication light | Red light wavelength=650nm | |
| Cooling mode | Air cooling | |
| Running temperature | 15ºC-35ºC | |
| Electrical source requirement | 110-220V/ 50Hz (60Hz) / 4A | |
| Dimensions (L*W*H) | 1.8'×2.6'×2.5' | |
| Weight | 121 KG | |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
