High temperature vacuum oven

Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and is equipped with independent over-lift preventer circuit, which not only improves work efficiency but also guarantees safety performance. It is widely used in research and application fields such as electronics, aerospace, military weapons, pharmaceuticals, biochemistry, etc. It is especially suitable for rapid drying of heat-sensitive, easily decomposed, easily oxidized, and complex ingredients in scientific research, universities, and enterprises, and can also be used for accelerated drying of powders and other materials.
 

PRODUCT FEATURES

1. Microcomputer integrated intelligent temperature control system, PID logic operation function, accurate and reliable temperature control.

2. Large-screen LCD instrument, three-row digital display, one screen displays operating temperature, set temperature, constant temperature time, heating status and other information.

3. High-precision medical-grade pointer vacuum gauge with accuracy up to 2.5.

4. Easy to operate, fixed value operation, program operation, fast automatic stop operation, automatic stop operation, and automatic start operation can all be realized.

5. Digital setting can be realized through dedicated function menu keys and up and down keys. With repeat function, it is divided into 3 sections and 30 steps program controller.

6. Through the auxiliary menu key, the operation of over-rise preventer, deviation correction and key lock setting can be realized.

7. With self-diagnostic circuit (temperature sensor abnormality, heater disconnection, automatic over-rise prevention, SSR short-circuit), over-rise preventer, leakage protection switch to prevent over-current, key lock and other safety functions.

8. According to the different needs of customers, we can design and manufacture box equipment with various parameters such as temperature, humidity, vacuum, cleanliness, gas concentration, etc.

9. Suitable temperature range, 40~200°C, suitable pressure range, 101~0.1kPa

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.