Audited Supplier
High Precision FPC Package Dispenser machine Automatic Silicone wafer Equipment factory
Standard Features
Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certifed
Optional Features
Automatic constant temperature system to ensure the fuidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation
Product advantage:
TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc.
Specifications |
TSV-300 |
HSV-300 |
Dimension (mm) |
L810×W660×H760 |
L900×W650×H1460 |
Weight (kg) |
105 |
190 |
Control |
Industrial personal computer + motion control card | |
Software |
Anda control software + windows system | |
Programming |
Visual programming | |
Number of spindles |
X,Y,Z | |
Spindle drive |
Servo motor + module | |
Working area (mm) |
X:260 ; Y:260 ; Z:100 | |
Quantity of rubber valve |
1 (standard configuration) | |
Max. Moving speed (mm/s) |
800 | |
Repeatability (mm) |
± 0.025 | |
Coating capacity (cc) |
30 | |
Valve nozzle cleaning device |
Vacuum cleaning | |
Equipment alarm |
Menu + sound and light alarm | |
Coating inspection |
Automatic detection | |
Power supply |
220V 50/60Hz | |
Required air pressure (Mpa) |
≥ 0.65 | |
Safety standards |
CE | |
Rated power (kw) |
1 | |
Standard configuration |
CCD visual positioning; Electrostatic interface; 232 scanner socket | |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
