High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach

• DA1201 IC Linear High Precision Die Attach

  Wafer size: 6"- 12";

  Dual dispensing system;

  High-precision linear driven bond head;

  Support DAF function;

  Multifunction work table, suitable for different kinds of lead frames & substrates;

  High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;

  Intelligent dispensing control system to realize precision glue volume control;

  Missing die detection and re-picking function;

  Programmable Pick / Bond Force;

  Customization for special design is also available.

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.