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Glass Substrate Laser Induced Drilling Machine Customized Picosecond/Femtosecond Laser
| Price | $1000000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 524 people viewed |
After-sales Service:
Provided
Condition:
New
Warranty:
12 Months
Automatic Grade:
Manual
Installation:
Vertical
Driven Type:
Pneumatic
Product Name:
Glass Substrate Laser Induced Drilling
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Product Features
Customized picosecond/femtosecond laser. Laser flight pulse pointing, compatible with
single point/spin cut drilling process. Integrated superior software algorithms that automatic optimization laser pointing and
cutting paths and directions
Automatic detection of undrilled holes
Application
Laser induced drilling through holes
and blind holes for special-shaped glass,
glass, RF components, optoelectronic
components, photomask plates, MEMS
components, glass based high-density
substrates, advanced wafer packaging,
glass spacer chips, Mini/Micro LED display
panel glass substrates, foldable screens, etc
and blind holes for special-shaped glass,
glass, RF components, optoelectronic
components, photomask plates, MEMS
components, glass based high-density
substrates, advanced wafer packaging,
glass spacer chips, Mini/Micro LED display
panel glass substrates, foldable screens, etc
| Technical specification | |
| Laser | Ultra-fast picosecond / femtosecond laser |
| Processing Product Size | X/Y: 350×350mm 12" glass wafer |
| Glass thickness | 100-1500μm |
| Focused spot diameter | <3μm |
| UPH | ≥5000 holes/sec |
| Platform positioning accuracy | ≤±2μm |
| Repeat Positioning Accuracy | ≤±1μm |
| Vision configuration | 10 million pixels |
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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