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Green Protective Film Al Ccl Aluminum Copper Clad Laminate for LED PCB
| Price | $30.00 |
|---|---|
| Min Order | 250 sheet |
| Availability | In Stock |
| Shipping From | Hainan, China |
| Popularity | 424 people viewed |
Model NO.:
Aluminum base
Structure:
Single-Sided Rigid PCB
Dielectric:
Rcc
Material:
Aluminum Base
Application:
Consumer Electronics
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Production Process:
Additive Process
Base Material:
Aluminum
Insulation Materials:
Rcc
Brand:
Hjh
Sheet Thickness:
0.6-2.0mm
Copper Thickness:
15um, 18um, 25um, 35um, 70um, Others
Protective Film Color:
Green
Thermal Conductivity:
0.6~2.0W
Aluminum Base Material:
1060 / 5052
Tg (DSC):
>130 Degree
Breakdown Voltage:
AC>/=5kv
Trademark:
HJH
Transport Package:
Pallet
Specification:
1000*1200MM, 500*600MM, others
Origin:
China
HS Code:
7410211000
Product Description
Aluminum Copper Clad Laminate Sheet
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052
Main Technical Characteristics
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052
Sheet Thickness: 0.6~2.0mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm
Thermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.K
Protective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics
| Items | Unit | Test condition | Typical values | ||
| AF-01 | AF-04 | AF-05 | |||
| Peel strength | N/mm | At normal: A | 2.00 | 1.05 | 1.08 |
| After thermal stress | 1.80 | 1.05 | 1.05 | ||
| Surface resistance | MΩ | At normal | 5.0 x 107 | 5.0 x 107 | 3.6 x 107 |
| Constant humidity treatment | 2.0 x 106 | 4.5 x 106 | 3.3 x 106 | ||
| Volume resistance | MΩ·m | At normal | 4.0 x 108 | 1.0 x 108 | 4.2 x 108 |
| Constant humidity treatment | 5.0 x 107 | 1.9 x 107 | 3.1 x 107 | ||
| Thermal resistance | ºC/w | At normal | 1.0 | 0.65 | 0.45 |
| Dielectric Constant @ 1 MHz | -- | 40ºC, 93%, 96h | 4.2 | 4.2 | 4.2 |
| Dielectric dissipation factor @1 MHz | -- | 40ºC, 93%, 96h | 0.02 | 0.029 | 0.033 |
| Thermal stress | min | 260ºC | 2 min, no delamination, no air bulb | ||
| Dielectric breakdown | KV/MM | At normal | 31 | 31 | 60 |
| Flammability | -- | At normal | FV-0 | ||
| Thermal-conductive factor | W/m·k | At normal | 1.0 | 1.5 | 2.2 |
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