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High Performance Digital Mipi Camera Edp Circuit Boards Support NFC Card Reader Qr GPS G-Sensor Type-C 4G SIM Card PCBA PCB
| Price | $1.06 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 289 people viewed |
Model NO.:
UC-02081700
Type:
Rigid Circuit Board
Dielectric:
FR-4
Material:
Fiberglass Epoxy
Application:
Consumer Electronics
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Processing Technology:
Electrolytic Foil
Base Material:
Copper
Insulation Materials:
Epoxy Resin
Brand:
UC
Board Layer:
10
Material Finished Thickness:
1.6mm
Base:
Fr4
Surface Treatment:
Immersion Gold/HASL Lead Free/ Immersion Silve
Solder Mask Color:
Green/White/Black/Blue/Red
Finished Copper Thickness:
All 1 Oz
Lead Time:
10 Working Days
Certificate:
UL(Us&Canada). ISO9001. RoHS, Ts, SGS
PCB Testing:
E-Testing, Flying Probe Testing
Fast Turn:
4 Working Days
Trademark:
UC
Transport Package:
Vacuum Package
Specification:
IPC class II
Origin:
Shenzhen, China
HS Code:
8534001000
Product Description
Ucreate LTD PCB's aim
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil Finished thickness | ||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
4.Products Equipment
Certificates:
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