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High Precision Machining and Consistency Wafer Laser Scribing / Cutting Equipment

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 469 people viewed
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After-sales Service:
Provided
Condition:
New
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Vertical
Driven Type:
Electric
Product Name:
Wafer Laser Scribing / Cutting
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
OEM/ODM Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Product Description
Product Features

  • Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

  • Correction technology ensures high precision machining and consistency

  • Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

  • Support warpage/TAIKO wafer transfer

 

Application
TAIKO ring cutting, Si/SiC
wafer cutting, Si/SiC wafer
Back metal cutting
Technical specification 
Laser wavelength355nm
Laser output power15/30W
Processing methodCombined scanning and linear/rotary stage motion
Positioning accuracy±1μm
Processing accuracy±5μm
Wafer size6 inch, 8 inch, 12 inch
Chipping<10μm
 
 
Exhibition & Customers


Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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