Audited Supplier
Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency
Correction technology ensures high precision machining and consistency
Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate
Support warpage/TAIKO wafer transfer
wafer cutting, Si/SiC wafer
Back metal cutting
| Technical specification | |
| Laser wavelength | 355nm |
| Laser output power | 15/30W |
| Processing method | Combined scanning and linear/rotary stage motion |
| Positioning accuracy | ±1μm |
| Processing accuracy | ±5μm |
| Wafer size | 6 inch, 8 inch, 12 inch |
| Chipping | <10μm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
