Audited Supplier
Custom C02 or UV/Green picosecond laser
Self-developed software and processing technology that meets different process requirements
Glue removal and window opening
Support multiple features for visual positioning
module after plastic sealing defect
repair, circuit board industry line repair,
tin ball rework, etc.
Through the upstream mes system to
export Mapping map coordinates, visual
positioning of defective areas, laser
removal, for subsequent process repair
| Technical specification | |
| Laser Type | CO2 ,UV/Green picosecond |
| Laser power | 30W |
| Cutting dynamic range | 180×180mm |
| CCD field of view | 80×80mm |
| XY drive mode | Servo motor |
| X-axis stroke | 300mm |
| Double Y-axis travel | 200mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
