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IC Leadframe Toolings for Qfp-64
| Price | Negotiable |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 285 people viewed |
Warranty:
1 Years Except Worn Parts
Application:
Electronic
Material:
Carbon Tool Steel
Processing Method:
Punching and Shearing Mould
Technics:
Forming Die
Process Combination:
Progressive Die
Manufacturing Technology:
Automation Technology
Driving Motor Type:
Hybrid
Mold Cavity Technology:
EDM Milling
Milling Speed:
High Speed
Parts Detection Method:
Measurement of Three Axis NC
Product Description
Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantity requirement,to find a balance and then bring a totally lowest cost for customer to ensure their competitive device.
PRODUCT ADVANTAGES
1. High precision molds inserts ,
2.Professional precision manufacturing,
3. High quality of materials, Long molds punch life
4.Well packaging for punching and cutting molds
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