IC Leadframe Toolings for Qfp-64

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Guangdong Taijin Semiconductor Technology Co., Ltd

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
1 Years Except Worn Parts
Electronic
Carbon Tool Steel
Punching and Shearing Mould
Forming Die
Progressive Die
Automation Technology
Hybrid
EDM Milling
High Speed
Measurement of Three Axis NC
Product Description

Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantity requirement,to find a balance and then bring a totally lowest cost for customer to ensure their competitive device.

 

PRODUCT ADVANTAGES

1. High precision molds inserts ,

2.Professional precision manufacturing,

3. High quality of materials, Long molds punch life

4.Well packaging for punching and cutting molds

 

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