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Manufacture High Efficiency Laser Glue Removal and Repair Machine with Visual Positioning

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 242 people viewed
Send Inquiry View Full Page
After-sales Service:
Provided
Condition:
New
Warranty:
Provided
Automatic Grade:
Manual
Installation:
Vertical
Driven Type:
Pneumatic
Product Name:
Laser Trimming
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
 
Product Description
Product Features

  • Custom C02 or UV/Green picosecond laser

  • Self-developed software and processing technology that meets different process requirements

  • Glue removal and window opening

  • Support multiple features for visual positioning

 
Application
Used for LED, Mini LED direct display
module after plastic sealing defect
repair, circuit board industry line repair,
tin ball rework, etc.
Through the upstream mes system to
export Mapping map coordinates, visual
positioning of defective areas, laser
removal, for subsequent process repair
 
Technical specification 
Laser TypeCO2 ,UV/Green picosecond
Laser power30W
Cutting dynamic range180×180mm
CCD field of view80×80mm
XY drive modeServo motor
X-axis stroke300mm
Double Y-axis travel200mm
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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