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Metallized Ceramic Substrates for RF Radio Frequency Applications

Price $100.00
Min Order 100 Pieces
Availability In Stock
Shipping From Guangdong, China
Popularity 326 people viewed
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Model NO.:
Customized
Application:
Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material:
Alumina Ceramic
Product Name:
Ceramic Substrates for RF Application
Optional Purity:
96%, 99% and 99.5% Alumina
Color:
White, Beige, Pink
Surface Treatment:
Polished, Glazed
Norminal:
1% of Dimensions
Usage:
for Ceramic to Metal Joint Technology
Type:
Ceramic Parts
Trademark:
JingHui
Transport Package:
Vacuum Packaging with Desciant
Specification:
36cm x 20cm x 24cm
Origin:
China
HS Code:
8547100000
Product Description
Metallized Ceramic Substrates for RF Radio Frequency Applications
Product Description

Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Differentfrom the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed electrochemically.

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Why choose us?

Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.

Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.

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