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Poly Diamond Alumina Silica CMP Sapphire Polishing Slurry Suspension

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Min Order 1 Gallon
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Shipping From Shanghai, China
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Model NO.:
CMP Polishing Slurry
Type:
Industrial Cleaning Cloth
Abrasive:
Corundum
Nylon Wheel Type:
Clean & Strip Wheel
Materials Abraded:
Nonferrous Metal
Grade:
Ultra-Fine
Wing Wheel Shape:
Interleaved
Fastening Type:
Arbor Hole
Color:
White
Industrial Cleaning Cloth Type:
Sanding Sponge
Trademark:
SIGNI
Transport Package:
Carton
Specification:
250 300 350
Origin:
China
HS Code:
3405900000
Product Description

CMP Polishing Suspension for Metallographic Specimens Polishing 

 

1. Appearance:

White water base suspension

2. Application:

 Polishing semiconductor wafers, precision ceramic, metal and other materials.

 

3. Specification:

 

Size (micron)

0.30,0.20,0.15,0.10

PH

11-13

3.5-4.5

Content %

19-22

29-31

Suspensibility

good

good

4. Characteristics:

(1) High purity alumina particles dispersed in deionized water medium

(2) Higher hardness makes it have good grinding performances than silica polishing slurry, not only can achieve higher grinding effect, but also can get better surface roughness.

5. Package:

500g/bottle; 5kg/barrel



SIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly
   engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove



 excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical
polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a 
wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on 
the pH.

SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality
 and price. 

Features
High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
High purity: the content of Cu2+<50 ppb, without contamination on the work piece 
Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
Typical Properties
Alkaline Type
pH: 9.8±0.5		SOQ-2SOQ-4SOQ-6SOQ-8SOQ-10SOQ-12
Acidic Type
pH: 2.8±0.5		ASOQ-2ASOQ-4ASOQ-6ASOQ-8ASOQ-10ASOQ-12
Grit Size(nm)10~3030~5050~7070~9090~110110~130
AppearanceMilk white or semitransparent liquid 
Density (g/ml)1. 15±0.05
 
ComponentContent(wt%)
SiO215~30
Na2O≤0.3
Heavy metal impurity≤50 ppb
 
Silica Wafer Polishing Reference Data
Polishing Pressure150 ~ 250 g/cm2
Polishing Temperature32 ~ 40 °C (89 ~ 104 °F) 
Dilution       1:1 - 20
Polishing duration3 ~ 6 minutes
 
Packaging: 
500 ml/bottle, 25 kg or 200 kg/barrel. 
Customizations are available upon requests.
 
Storage: 
Keep the stored temperature at 0~35ºC (32~95 °F). Frozen can result in irreversible product degradation below 0ºC. High temperature above 35 ºC may accelerate the
 growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is
 about half a year. 




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