Audited Supplier
CMP Polishing Slurry
Industrial Cleaning Cloth
Corundum
Clean & Strip Wheel
Nonferrous Metal
Ultra-Fine
Interleaved
Arbor Hole
White
Sanding Sponge
SIGNI
Carton
250 300 350
China
3405900000
Product Description
CMP Polishing Suspension for Metallographic Specimens Polishing
1. Appearance:
White water base suspension
2. Application:
Polishing semiconductor wafers, precision ceramic, metal and other materials.
3. Specification:
Size (micron) | 0.30,0.20,0.15,0.10 | |
PH | 11-13 | 3.5-4.5 |
Content % | 19-22 | 29-31 |
Suspensibility | good | good |
4. Characteristics:
(1) High purity alumina particles dispersed in deionized water medium
(2) Higher hardness makes it have good grinding performances than silica polishing slurry, not only can achieve higher grinding effect, but also can get better surface roughness.
5. Package:
500g/bottle; 5kg/barrel
SIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly
engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove
excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical
polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a
wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on
the pH.
SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality
and price.
Features
High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
High purity: the content of Cu2+<50 ppb, without contamination on the work piece
Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
| Typical Properties | ||||||
| Alkaline Type pH: 9.8±0.5 | SOQ-2 | SOQ-4 | SOQ-6 | SOQ-8 | SOQ-10 | SOQ-12 |
| Acidic Type pH: 2.8±0.5 | ASOQ-2 | ASOQ-4 | ASOQ-6 | ASOQ-8 | ASOQ-10 | ASOQ-12 |
| Grit Size(nm) | 10~30 | 30~50 | 50~70 | 70~90 | 90~110 | 110~130 |
| Appearance | Milk white or semitransparent liquid | |||||
| Density (g/ml) | 1. 15±0.05 | |||||
| Component | Content(wt%) |
| SiO2 | 15~30 |
| Na2O | ≤0.3 |
| Heavy metal impurity | ≤50 ppb |
| Silica Wafer Polishing Reference Data | |
| Polishing Pressure | 150 ~ 250 g/cm2 |
| Polishing Temperature | 32 ~ 40 °C (89 ~ 104 °F) |
| Dilution | 1:1 - 20 |
| Polishing duration | 3 ~ 6 minutes |
Packaging:
500 ml/bottle, 25 kg or 200 kg/barrel.
Customizations are available upon requests.
Storage:
Keep the stored temperature at 0~35ºC (32~95 °F). Frozen can result in irreversible product degradation below 0ºC. High temperature above 35 ºC may accelerate the
growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is
about half a year.
