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Rie Machine-RF Reactive Ion Etching

Price $150000.00
Min Order 1 Piece
Availability In Stock
Shipping From Guangdong, China
Popularity 531 people viewed
Model NO.:
MD-200RIE
After-sales Service:
Installation, Training
Warranty:
One Year Warranty
Type:
Electrical Etching Machine
Object:
Silicon-Based:Si/Sio2/Sinxsic
Usage:
Corrosion & Hollowed-out
Certification:
ISO9001: 2000, CE
Etching Type:
Reactive Ion Etching
Precision:
High Precision
Condition:
New
Trademark:
Minder-Hightech
Transport Package:
Wooden Case
Specification:
1170*750*1080mm
Origin:
China
Product Description
Reactive ionomer etching machine
ItemMD150-RIEMD200-RIEMD200C-RIE
Product size≤6 inches≤8 inches≤8 inches
RF power source0-300W/500W/1000W Adjustable,automatic matching
Molecular pump-/620(L/s)/1300(L/s)/CustomAntiseptic620(L/s)/1300(L/s)/Custom
Foreline pumpMechanical pump/dry pumpDry pump
Process pressureUncontrolled pressure/0-1Torr controlled pressure
Gas typeH/CH4/O2/N2/Ar/SF6/CF4/
CHF3/C4F8/NF3/Custom
(Up to 9 channels, no corrosive & toxic gas)
H2/CH4/O2/N2/Ar/F6/CF4/ CHF3/C4F8/NF3/Cl2/BCl3/HBr(Up to 9 channels)
Gas range0~5sccm/50sccm/100sccm/200sccm/300sccm/500sccm/custom
LoadLockYes/NoYes
Sample tem control10°C~Room tem/-30°C~100°C/Custom-30°C~100°C /Custom
Back helium coolingYes/NoYes
Process cavity liningYes/NoYes
Cavity wall tem controlNo/Roomtem~60/120°CRoom tem-60/120°C
Control SystemAuto/custom
Etching materialSilicon-based:Si/SiO2/SiNx···
IV-IV: SiC
Magnetic materials/alloy materials
Metallic material: Ni/Cr/Al/Au.....
Organic material: PR/PMMA/HDMS/Organic
film......
Silicon-based: Si/SiO2/SiNx......
III-V(3): InP/GaAs/GaN......
IV-IV: SiC
II-VI (3): CdTe......
Magnetic materials/alloy materials
Metallic material: Ni/Cr/A1/Au......
Organic material: PR/PMMA/HDMS /organic film...

Process result
Silicon-based material etching
Silicon-based materials, nano-imprint patterns, array
patterns and lens pattern etching

InP normal temperature etching
Pattern etching of InP based devices used in optical communication, including waveguide structure, resonant cavity structure ridge structure etc

SiC material etching
Suitable for microwave devices, power devices, etc


Physical sputtering, etching  Organic materiale tching
It is applied to the etching of difficult to etch materials such as some metals (such as Ni / Cr) and ceramics, and the patternede tching of materials is realized by physical bombardment.It is used for etching and removal of organic compounds such as photoresist (PR)/ PMMA / HDMS / polymer

Cermet film material (Au/Ni/Cr/Al2O3)

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