Negotiable
1 Set (MOQ)
FC Packaging Cleaning Machine
Guangdong Advance Spray Cleaning Technology Co., Ltd.
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SIP Cleaning System
| Price | Negotiable |
|---|---|
| Min Order | 1 Set |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 419 people viewed |
Model NO.:
FC820
After-sales Service:
on Site, 7daysx24hours Technical Support
Warranty:
1year
Application:
Semiconductor Packaging Flux Clean
Cleaning Media:
Wet Cleaning
Automation:
Automatic
Cleaning Precision:
Precision Industrial Cleaning
Control:
PLC
Principle:
Chemical Cleaning
Certification:
CE, CB, ETL, RoHS, UR
Condition:
New
Customized:
Customized
Feature:
Clean Thoroughly
Trademark:
ACTSPRAY
Transport Package:
Plywood and Vacuum Package
Specification:
L8000*W1800*H1750mm
Origin:
Dongguan, Guanddong, China
HS Code:
8479899990
Product Description
FC820 System Mainly used to clean flux residual and solder balls on FC/SiP chips after soldering. The system adopts SUS304 flat net conveyor transportation system; high pressure and high flow upper and lower spray cleaning process to wash,rinse and dry Chips(substrate) automatically.
Put in SIP modulars → water vapor isolation → chemical liquid wash1 → chemical liquid wash2 →chemical liquid wash3→ chemical isolation → DI water pre-rinse → DI water rinse1 →DI wateer rinse2→ DI water final rinse → Air blow → hot air dry 1 → hot air dry 2 → send out SIP modulars
Put in SIP modulars → water vapor isolation → chemical liquid wash1 → chemical liquid wash2 →chemical liquid wash3→ chemical isolation → DI water pre-rinse → DI water rinse1 →DI wateer rinse2→ DI water final rinse → Air blow → hot air dry 1 → hot air dry 2 → send out SIP modulars
- Wash1 section: Soften and decrease the biscosity of flux or dusts.
- Wash2&3 section:Wash flux and dusts particles on Chip(substrate).
- Chemical isolation section: Isolation liquid between wash and DI water pre-rinse section.
- Pre-rinse section: DI water rinse flux and liquid on Chip(substrate).
- Rinse1&2 section: Further rinse flux and ion contamination on Chip(substrate).
- Final rinse section: remove rinse ion contamination on Chip(substrate).
- Air blow section: Blow off DI water residual on Chip(substrate).
- Hot air dry section: Hot air blow to toast moisture on Chip(substrate).
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