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Silicon Wafer Back Grinding Wheel Diamond Wheel Factory Direct Supplying Wheel

Price $2500.00
Min Order 1 pieces
Availability In Stock
Shipping From Henan, China
Popularity 356 people viewed
Model NO.:
HT-1
Material:
Imported Diamond Abrasive
Application:
Deburring, Ferrous Metals
Viscosity:
Customized
Grit Size (JIS):
80#---1000#
Shape:
Cylindrical
Warranty:
1 Years
Service:
7 Days/24 Hours
Feature:
Long Life
Grinding Material:
Cubic Boron Carbide
Customized Support:
OEM, ODM
Bonding Agent:
Vitrified & Resin
Product Name:
Diamond Grinding Wheel
Package:
Wooden Box
Wheel Type:
Angle Grinding Wheels
Bond:
Vitrified & Resin
Wheel Base:
Steel
Trademark:
HT
Transport Package:
Wooden Boxes
Origin:
Henan, China
Product Description

grinding wheel

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing
blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles,
aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other
industries.
 
Silicon Wafer Back Grinding Wheels
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:

1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name
Silicon Wafer Back  grinding wheel
OEM
Supported
Advantage
Good performance
Size
Customized
Bond
CBN&Diamond
Grit size
Customized
OED
Supported
Package
Woonden box & cartoon box
 
 
 
 
 
 
 
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