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30000 Pieces (MOQ)
Ge002 Protective Black Welding Lens 3mm Shade No 9-14 Welding Glass
NINGBO WELWORK PPE CO., LTD.
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Solder Preform Bi57Sn42Ag1 for Low Temperature Microelectronic Packaging Assembly
| Price | $3.00 |
|---|---|
| Min Order | 1000 Pieces |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 305 people viewed |
Model NO.:
B22
Melting Point:
138-140°c
Customized Support:
OEM, ODM
Lead Time:
1-2 Weeks
Certificate:
RoHS, ISO 9001, ISO 14001, GB/T 29490
Delivery Method:
Air Freight
Trademark:
XianYi
Transport Package:
Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
Specification:
Bi57Sn42Ag1 Preform
Origin:
Guangzhou
HS Code:
8106009090
Product Description
Bi57Sn42Ag1 Solder Preforms
Features:
- Low temperature lead-free solder
- Higher strength and fatigue resistance comparing to Sn63Pb37
- Good wettability
Description:
Bi57Sn42Ag1 solder have a melting temperature as low as 138ºC~ 140ºC . The addition of Bi lower the melting temperature, surface tension and the reaction rate between solder and copper, ensuring good wettability. Besides, Bi57Sn42Ag1 has
higher strength and fatigue resistance comparing to Sn63Pb37. Bi57Sn42Ag1 solder has been widely used in low temperature assembly of microelectronic devices.
Solder Composition:
Physical Properties:
Method of Use:
Reflow Profile
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
- Flux Compatibility:
Bi57Sn42Ag1 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.
Features:
- Low temperature lead-free solder
- Higher strength and fatigue resistance comparing to Sn63Pb37
- Good wettability
Description:
Bi57Sn42Ag1 solder have a melting temperature as low as 138ºC~ 140ºC . The addition of Bi lower the melting temperature, surface tension and the reaction rate between solder and copper, ensuring good wettability. Besides, Bi57Sn42Ag1 has
higher strength and fatigue resistance comparing to Sn63Pb37. Bi57Sn42Ag1 solder has been widely used in low temperature assembly of microelectronic devices.
Solder Composition:
| Element | Wt% |
| Bismuth (Bi) | Margin |
| Tin (Sn) | 42.0 ± 0.5 |
| Silver(Ag) | 1.0 ± 0.1 |
Physical Properties:
| Product name | Melting point/ºC solid / liquid phase | Density g/cm3 | Resistivity µΩ·m | Thermal conductivity W/m·K | Thermal expansion coefficient 10-6/ºC | Tensile strength Mpa |
Bi57Sn42Ag1 | 138~140 | 8.57 | / | 35 | 14 | / |
Method of Use:
Reflow Profile
| Preheating stage | Heat preservation stage | Soldering stage | Cooling stage |
| Room-temperature ~ 110ºC | 110~ 138ºC | 138~ 165ºC | 138ºC ~ Room-temperature |
| Time | Time | Time | Cooling rate |
| 1.5~2min | 2.5~3.5min | 1.5~2min | 3 ~ 5ºC/s |
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
| Atmosphere | Parameter requirements |
| N2 | Oxygen concentration(200~ 1000ppm) |
| Vacuum | Vacuum degree ≤ 2.0×10-3Pa |
- Flux Compatibility:
Bi57Sn42Ag1 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
| Thickness(t) | Typical tolerances for length, width or diameter(L/W/D) | |
| t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±0.05mm | |
| Thickness(t) | Thickness (t) | |
| Conventional solder alloys | Indium alloy | |
| t<0.05mm | ±0.005mm | ±0.01mm |
| 0.05mm≤ t <0. 10mm | ±0.008mm | ±0.01mm |
| 0. 10mm≤ t <0.20mm | ±0.01mm | |
| 0.20mm≤ t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±5% | |
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
| Category | Products | Solidus(ºC) | Liquidus(ºC) | Density (g/cm3) | Resistivity (μΩ·m) | Thermal Conductivity (W/m ·K) | CTE (10-6/ºC) | Tensile Strength (MPa) |
Solder Metal | In51Bi32.5Sn16.5 | / | 60(e) | 7.88 | 0.522 | / | 22 | 33.44 |
| In66.3Bi33.7 | / | 72(e) | 7.99 | / | / | / | / | |
| Bi50Pb28Sn22 | / | 100(e) | 9.44 | / | / | / | / | |
| In52Sn48 | / | 118(e) | 7.3 | 0. 147 | 34 | 20 | 12 | |
| In50Sn50 | 118 | 125 | 7.3 | 0. 147 | 34 | 20 | 11.86 | |
| Bi58Sn42 | / | 138(e) | 8.56 | 0.383 | 19 | 15 | 55. 16 | |
| Bi57Sn42Ag1 | 138 | 140 | 8.57 | / | / | / | / | |
| In97Ag3 | / | 143(e) | 7.38 | 0.075 | 73 | 22 | 5.5 | |
| Sn43Pb43Bi14 | 144 | 163 | 9.02 | / | / | 24 | 44. 1 | |
| In80Pb15Ag5 | 149 | 154 | 7.85 | 0. 133 | 43 | 28 | 17.58 | |
| Sn53Pb37Bi10 | 150 | 168 | 8.65 | / | / | / | / | |
| Sn70Pb18In12 | 154 | 167 | 7.79 | 0. 141 | 45 | 24 | 36.68 | |
| In100 | / | 157(mp) | 7.31 | 0.072 | 86 | 29 | 1.88 | |
| In70Pb30 | 165 | 175 | 8. 19 | 0. 195 | 38 | 28 | 23.79 | |
| In60Pb40 | 174 | 185 | 8.52 | 0.246 | 29 | 27 | 28.61 | |
| Sn77.2In20Ag2.8 | 175 | 187 | 7.25 | 0. 176 | 54 | 28 | 46.88 | |
| Sn62Pb36Ag2 | / | 179(e) | 8.42 | 0. 145 | 42 | 27 | 44 | |
| Sn63Pb37 | / | 183(e) | 8.4 | 0. 146 | 51 | 25 | 52 | |
| In50Pb50 | 184 | 210 | 8.86 | 0.287 | 22 | 27 | 32.2 | |
| Pb60In40 | 197 | 231 | 9.3 | 0.331 | 19 | 26 | 34.48 | |
| Sn86.9In10Ag3. 1 | 201 | 205 | 7.37 | / | / | / | / | |
| Au10Sn90 | / | 217(e) | 7.78 | / | / | / | 50.2 | |
| SAC387(Sn95.5Ag3.8Cu0.7) | / | 217(ne) | 7.4 | 0. 132 | 57 | 22 | 48 | |
| SAC305(Sn96.5Ag3.0Cu0.5) | 217 | 218 | 7.37 | 0. 132 | 58 | 21 | 50 | |
| Sn96.5Ag3.5 | / | 221(e) | 7.37 | 0. 108 | 33 | 30 | 39 | |
| Sn99.3Cu0.7 | / | 227(e) | 7.31 | / | / | / | / | |
| Sn100 | / | 232(mp) | 7.29 | 0. 111 | 73 | 24 | 13. 1 | |
| Sn65Ag25Sb10 | / | 233(e) | 7.8 | / | / | 36 | 117.2 | |
| Sn95Sb5 | 235 | 240 | 7.25 | 0. 145 | 28 | 31 | 40.7 | |
| Sn90Sb10 | 240 | 250 | 7.22 | / | 42 | 27 | 44 | |
| Pb75In25 | 240 | 260 | 9.97 | 0.375 | 18 | 26 | 37.58 | |
| Pb88Sn10Ag2 | 268 | 290 | 10.75 | 0.203 | 27 | 29 | 22.48 | |
| Pb90Sn10 | 275 | 302 | 10.75 | / | / | 24.6 | 32 | |
| Au80Sn20 | / | 280(e) | 14.52 | 0.224 | 57 | 16 | 276 | |
| Pb92.5Sn5Ag2.5 | 287 | 296 | 11.02 | 0.2 | 29 | 24 | 29.03 | |
| Pb90Sn5Ag3In2 | 294 | 297 | 10.89 | / | / | / | / | |
| Pb92.5In5Ag2.5 | 300 | 310 | 11.02 | 0.313 | 25 | 25 | 31.44 | |
| Au88Ge12 | / | 361(e) | 14.67 | 0. 151 | 44 | 13.4 | 185 | |
| Au96.8Si3.2 | / | 363(e) | 15.4 | / | 27 | 12 | 255 | |
| Au98Si2 | 363 | 390 | 16.92 | / | / | / | / | |
Brazing Metal | Ag60Cu30Sn10 | 600 | 720 | 9.58 | / | / | / | / |
| Ag72Cu28 | / | 780(e) | 10 | / | 352 | 17.8 | 250-360 | |
| Ag50Cu50 | 780 | 870 | 9.67 | / | / | / | / | |
| Au60Ag20Cu20 | 835 | 845 | 13.79 | / | / | / | / | |
| Ag92.5Cu7.5 | / | / | 10.37 | / | / | / | / | |
| Au80Cu20 | / | 910(e) | 15.67 | / | / | / | / | |
| Au50Cu50 | 955 | 970 | 12.22 | / | / | / | / | |
| Ag100 | / | 961(mp) | 10.49 | 0.0163 | 429 | / | 180 | |
| Au100 | / | 1064(mp) | 19.3 | 0.0221 | 318 | 14 | 138 | |
| Cu100 | / | 1083(mp) | 8.96 | 0.0172 | 401 | / | 246 |
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