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Solder Preform In100 for Low Temperature Indium-Based Solder in Laser Diode Applications
| Price | $3.00 |
|---|---|
| Min Order | 1000 Pieces |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 262 people viewed |
Model NO.:
E05
Melting Point:
157°c
Customized Support:
OEM, ODM
Lead Time:
1-2 Weeks
Certificate:
RoHS, ISO 9001, ISO 14001, GB/T 29490
Delivery Method:
Air Freight
Trademark:
XianYi
Transport Package:
Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
Specification:
In100 Preform
Origin:
Guangzhou
HS Code:
8112993000
Product Description
Sn90Sb10 Solder Preforms
Features:
- Lead-free solder
- Melting temperature 157ºC
- Good ductility and thermal conductivity
- Good fatigue resistance
Description:
Indium is a kind of low temperature lead-free solder with a melting temperature of 157ºC . It has high boiling point and resistance against alkali and salt solutions. Most material including metal and nonmetal can be wetted by indium. Indium can inhibit the corrosion of Au or Ag. Meanwhile, Indium-based alloys possess low melting temperature, excellent fatigue resistance, good ductility and thermal conductivity, making them suitable for soldering of glass and ceramics.
Solder Composition:
Physical Properties:
Method of Use:
Reflow Profile
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
- Flux Compatibility:
In100 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.
Features:
- Lead-free solder
- Melting temperature 157ºC
- Good ductility and thermal conductivity
- Good fatigue resistance
Description:
Indium is a kind of low temperature lead-free solder with a melting temperature of 157ºC . It has high boiling point and resistance against alkali and salt solutions. Most material including metal and nonmetal can be wetted by indium. Indium can inhibit the corrosion of Au or Ag. Meanwhile, Indium-based alloys possess low melting temperature, excellent fatigue resistance, good ductility and thermal conductivity, making them suitable for soldering of glass and ceramics.
Solder Composition:
| Element | Wt% |
| Indium (In) | ≥99.99 |
Physical Properties:
| Product name | Melting point/ºC solid / liquid phase | Density g/cm3 | Resistivity µΩ·m | Thermal conductivity W/m·K | Thermal expansion coefficient 10-6/ºC | Tensile strength Mpa |
In100 | 157 | 7.31 | 0.072 | 86 | 29 | 1.88 |
Method of Use:
Reflow Profile
| Preheating stage | Heat preservation stage | Soldering stage | Cooling stage |
| Room-temperature ~ 110ºC | 110~ 157ºC | 157~ 185ºC | 157ºC ~ Room-temperature |
| Time | Time | Time | Cooling rate |
| 50~90s | 50~120s | 40~90s | 3 ~ 5ºC/s |
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
- Operating environment:
| Atmosphere | Parameter requirements |
| N2 | Oxygen concentration(200~ 1000ppm) |
| Vacuum | Vacuum degree ≤ 2.0×10-3Pa |
- Flux Compatibility:
In100 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.
Dimension Tolerance:
| Thickness(t) | Typical tolerances for length, width or diameter(L/W/D) | |
| t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±0.05mm | |
| Thickness(t) | Thickness (t) | |
| Conventional solder alloys | Indium alloy | |
| t<0.05mm | ±0.005mm | ±0.01mm |
| 0.05mm≤ t <0. 10mm | ±0.008mm | ±0.01mm |
| 0. 10mm≤ t <0.20mm | ±0.01mm | |
| 0.20mm≤ t <0.40mm | ±0.02mm | |
| 0.40mm≤ t <1.00mm | ±0.03mm | |
| t ≥1.00mm | ±5% | |
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
| Category | Products | Solidus(ºC) | Liquidus(ºC) | Density (g/cm3) | Resistivity (μΩ·m) | Thermal Conductivity (W/m ·K) | CTE (10-6/ºC) | Tensile Strength (MPa) |
Solder Metal | In51Bi32.5Sn16.5 | / | 60(e) | 7.88 | 0.522 | / | 22 | 33.44 |
| In66.3Bi33.7 | / | 72(e) | 7.99 | / | / | / | / | |
| Bi50Pb28Sn22 | / | 100(e) | 9.44 | / | / | / | / | |
| In52Sn48 | / | 118(e) | 7.3 | 0. 147 | 34 | 20 | 12 | |
| In50Sn50 | 118 | 125 | 7.3 | 0. 147 | 34 | 20 | 11.86 | |
| Bi58Sn42 | / | 138(e) | 8.56 | 0.383 | 19 | 15 | 55. 16 | |
| Bi57Sn42Ag1 | 138 | 140 | 8.57 | / | / | / | / | |
| In97Ag3 | / | 143(e) | 7.38 | 0.075 | 73 | 22 | 5.5 | |
| Sn43Pb43Bi14 | 144 | 163 | 9.02 | / | / | 24 | 44. 1 | |
| In80Pb15Ag5 | 149 | 154 | 7.85 | 0. 133 | 43 | 28 | 17.58 | |
| Sn53Pb37Bi10 | 150 | 168 | 8.65 | / | / | / | / | |
| Sn70Pb18In12 | 154 | 167 | 7.79 | 0. 141 | 45 | 24 | 36.68 | |
| In100 | / | 157(mp) | 7.31 | 0.072 | 86 | 29 | 1.88 | |
| In70Pb30 | 165 | 175 | 8. 19 | 0. 195 | 38 | 28 | 23.79 | |
| In60Pb40 | 174 | 185 | 8.52 | 0.246 | 29 | 27 | 28.61 | |
| Sn77.2In20Ag2.8 | 175 | 187 | 7.25 | 0. 176 | 54 | 28 | 46.88 | |
| Sn62Pb36Ag2 | / | 179(e) | 8.42 | 0. 145 | 42 | 27 | 44 | |
| Sn63Pb37 | / | 183(e) | 8.4 | 0. 146 | 51 | 25 | 52 | |
| In50Pb50 | 184 | 210 | 8.86 | 0.287 | 22 | 27 | 32.2 | |
| Pb60In40 | 197 | 231 | 9.3 | 0.331 | 19 | 26 | 34.48 | |
| Sn86.9In10Ag3. 1 | 201 | 205 | 7.37 | / | / | / | / | |
| Au10Sn90 | / | 217(e) | 7.78 | / | / | / | 50.2 | |
| SAC387(Sn95.5Ag3.8Cu0.7) | / | 217(ne) | 7.4 | 0. 132 | 57 | 22 | 48 | |
| SAC305(Sn96.5Ag3.0Cu0.5) | 217 | 218 | 7.37 | 0. 132 | 58 | 21 | 50 | |
| Sn96.5Ag3.5 | / | 221(e) | 7.37 | 0. 108 | 33 | 30 | 39 | |
| Sn99.3Cu0.7 | / | 227(e) | 7.31 | / | / | / | / | |
| Sn100 | / | 232(mp) | 7.29 | 0. 111 | 73 | 24 | 13. 1 | |
| Sn65Ag25Sb10 | / | 233(e) | 7.8 | / | / | 36 | 117.2 | |
| Sn95Sb5 | 235 | 240 | 7.25 | 0. 145 | 28 | 31 | 40.7 | |
| Sn90Sb10 | 240 | 250 | 7.22 | / | 42 | 27 | 44 | |
| Pb75In25 | 240 | 260 | 9.97 | 0.375 | 18 | 26 | 37.58 | |
| Pb88Sn10Ag2 | 268 | 290 | 10.75 | 0.203 | 27 | 29 | 22.48 | |
| Pb90Sn10 | 275 | 302 | 10.75 | / | / | 24.6 | 32 | |
| Au80Sn20 | / | 280(e) | 14.52 | 0.224 | 57 | 16 | 276 | |
| Pb92.5Sn5Ag2.5 | 287 | 296 | 11.02 | 0.2 | 29 | 24 | 29.03 | |
| Pb90Sn5Ag3In2 | 294 | 297 | 10.89 | / | / | / | / | |
| Pb92.5In5Ag2.5 | 300 | 310 | 11.02 | 0.313 | 25 | 25 | 31.44 | |
| Au88Ge12 | / | 361(e) | 14.67 | 0. 151 | 44 | 13.4 | 185 | |
| Au96.8Si3.2 | / | 363(e) | 15.4 | / | 27 | 12 | 255 | |
| Au98Si2 | 363 | 390 | 16.92 | / | / | / | / | |
Brazing Metal | Ag60Cu30Sn10 | 600 | 720 | 9.58 | / | / | / | / |
| Ag72Cu28 | / | 780(e) | 10 | / | 352 | 17.8 | 250-360 | |
| Ag50Cu50 | 780 | 870 | 9.67 | / | / | / | / | |
| Au60Ag20Cu20 | 835 | 845 | 13.79 | / | / | / | / | |
| Ag92.5Cu7.5 | / | / | 10.37 | / | / | / | / | |
| Au80Cu20 | / | 910(e) | 15.67 | / | / | / | / | |
| Au50Cu50 | 955 | 970 | 12.22 | / | / | / | / | |
| Ag100 | / | 961(mp) | 10.49 | 0.0163 | 429 | / | 180 | |
| Au100 | / | 1064(mp) | 19.3 | 0.0221 | 318 | 14 | 138 | |
| Cu100 | / | 1083(mp) | 8.96 | 0.0172 | 401 | / | 246 |
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