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Stable and Reliable Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 336 people viewed
Send Inquiry View Full Page
After-sales Service:
Provided
Condition:
New
Warranty:
Provided
Automatic Grade:
Manual
Installation:
Vertical
Driven Type:
Pneumatic
Product Name:
Glass Cutting & Lobing
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
 
Product Description
Product Features

  • Ultra-fast pulsed picosecond laser with high peak power, stable and reliable

  • Self-developed cutting process technology patent, excellent kerf quality, no surface damage

  • High dimensional accuracy, small chipping, low thermal impact, excellent processing quality

  • Automatic loading and unloading, inspection, sorting and lobe functions

Application
Cutting of full-screen glass,
sapphire, digital 3D front and
back cover glass, various
optical glass, and filter glass
echnical specification 
Cutting LaserPicosecond 1064nm Laser
Lobe LaserCO2
Cutting Laser Power70W
Lobe Laser Power55W
Laser Life>20000h
Platform Speed1000mm/s
Control System SoftwareIntegrated vision, laser and motion
 
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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