99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Alumina Ceramic Wafer Polishing Plate
Type:
Disc Grinder
Power Source:
Chemical Mechanical Polishing
Object:
Wafer
Application:
Semiconductor
Disc(Wheel) Type:
Polishing Plate
Material:
Alumina Ceramics
Working Style:
Chemical Mechanical Polishing
Disc Diameter:
Within 850mm
Trademark:
Chemshun Ceramics
Transport Package:
Carton and Wooden Box
Specification:
size below ∅ 850mm, thickness 45mm.
Origin:
China
HS Code:
6909191200