Android Mobile Phone Motherboard PCB Assembling Android Mobile Phone Motherboard Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
012
Type:
Flexible Circuit Board
Dielectric:
FR-4
Application:
Communication
Flame Retardant Properties:
V2
Mechanical Rigid:
Fexible
Processing Technology:
Electrolytic Foil
Base Material:
Aluminum
Insulation Materials:
Organic Resin
Brand:
Longyi
Copper Thickness:
1oz
Surface Finishing:
Lead-Free HASL
Trademark:
longyi
Transport Package:
Paper Box
Specification:
1.6 mm-3.2 mm
Origin:
Dongguan City, China