Back Grinding Wheels for Semiconductor Wafers Process Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Silicon wafer wheel
Type:
Thinning
Material:
Diamond Abrasive
Application:
Silicon Wafer Back
Effect:
Polishing
Grit Size (JIS):
80#---1000#
Shape:
Cylindrical
Warranty:
1 Years
Service:
7 Days/24 Hours
Feature:
Long Life
Grinding Material:
Cubic Boron Carbide
Customized Support:
OEM, ODM
Bonding Agent:
Vitrified & Resin
Product Name:
Diamond Grinding Wheel
Package:
Wooden Box
Wheel Type:
Angle Grinding Wheels
Bond:
Vitrified & Resin
Wheel Base:
Steel or Aluminium
Trademark:
HT
Transport Package:
Wooden Boxes
Specification:
JB
Origin:
Henan, China