High Lead Sn10pb90 Solder Ball BGA Planting Ball High Temperature Video, Demo, How It Works & Features
This video cannot be played in your browser.
Need price or Contact this supplier?
Get a Quote
Product Specifications
Model NO.:
Sn10
Packing:
250K
Melting Point:
287°c
Application:
Chip/BGA Soldering
Composition:
Sn10pb90
Trademark:
YOSHDIA
Transport Package:
Carton+Foam Box
Specification:
0.2-. 88mm
Origin:
China