High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System Eutectic Crystal Planting Machine Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
MDZW-TP2032
After-sales Service:
1 Year
Condition:
New
Speed:
Super High Speed
Precision:
High Precision
Certification:
CE
Warranty:
12 Months
Automatic Grade:
Automatic
Type:
High-speed Chip Mounter
Weight:
800
Power Supply:
AC220V Earth 10%, 50-60Hz, 10A
Compressed Air:
>=0.2MPa, Flow Rate>5lpm,
Thickness:
50um-17mm
Trademark:
minder-hightech
Transport Package:
840 * 1220 * 2000mm
Specification:
840 * 1220 * 2000mm
Origin:
China