Lead-Free Solder Paste for Efficient Electronics Assembly Solutions Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
MC-303-4
state:
Paste
Type:
Lead-Free Solder Paste
Melting Point:
217-221ºC
Chemical Composition:
Sn99 AG0.3 Cu0.7
Function:
Printing Application
Selling Units:
Single Item
Single Gross Weight:
0.500 Kg
Storage Condition:
2-10ºC
Powder Size:
T4: 20 - 38μm; T5: 15 - 25μm
Appearance:
Uniform Paste, No Flux Separation
Weight:
500±5g
Customize Support:
OEM,ODM
Viscosity:
190 ± 30PA·s (Can Be Customized as R
Product Name:
Solder Paste
Product Name2:
No-Clean Solder Paste
Single Package Size:
10X5X5cm
Trademark:
APS
Specification:
500g
Origin:
Fujian, China
HS Code:
3810100000