Multilayer PCB Electronic Board Mobile Phone PCB Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
USUN-763
Structure:
Multilayer Rigid PCB
Dielectric:
FR-4
Material:
Epoxy Resin
Application:
Communication
Processing Technology:
Electrolytic Foil
Production Process:
Immersion Gold
Base Material:
It180A
Board Thickness:
1.6mm
Copper Thickness:
2oz
Test:
Flying Probe & Fixture
Solder Mask Type:
Green
Min.Line Width/Space:
0.1mm
Min. Hole Size:
0.2mm
Certification:
RoHS, CCC, ISO, EPA
Customized:
Customized
Transport Package:
Bubble Pack+Aluminum Foil Pack
Origin:
China
HS Code:
853400900