Pcf8574ap New Original Integrated Circuit IC Chips Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
PCF8574AP
Structure:
Multilayer Rigid PCB
Dielectric:
Fr-4
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Production Process:
Semi-Additive Process
Base Material:
Copper
Insulation Materials:
Metal Composite Materials
Board Thickness:
2mm
Copper Thickness:
1oz
Test:
Flying Probe & Fixture
Solder Mask Type:
Green
Min.Line Width/Space:
4/4mil
Min. Finished Hole Size:
4mm
Certification:
RoHS, CCC, ISO, EPA
Customized:
Customized
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
DIP(Dual In-line Package)
Signal Processing:
Simulation
Application:
Solar Cell
Batch Number:
2023
Trademark:
Rogers
Transport Package:
Bubble Pack+Aluminum Foil Pack
Specification:
580*620
Origin:
China
HS Code:
8534009000