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Relay Edge Sealing with Potting Resin for Electronics Protection Video, Demo, How It Works & Features

Published: 2025-04-09 Published by: Guangzhou Tianze Novel Materials Technology Co., Ltd. 290 views 0 comments

Product Specifications

Model NO.:
5203BK
Bonding Function:
Structural Adhesive
Morphology:
Water Emulsion
Application:
Automobile, Electronics Assembly
Material:
Epoxy
Classification:
Thermosetting
Main Agent Composition:
Thermosetting Resin
Characteristic:
Weatherability
Promoter Composition:
Tackifier
Composition:
Inorganic Material
Color:
Black
Product Name:
Adhesive Glue
Keyword:
Epoxy Adhesive
Viscidity:
Customization
Chemical Composition:
Epoxy
Curing Condition:
5 Sec. @ 80 W/Cm
Shelf Life and Temperature:
3 Months
Product Features:
Heat and Weather Resistance
Typical Application:
Potting and Bonding of Inductor Coils and Cores
Bonding Strength:
Strong
Materials:
Epoxy Resin Adhesive, Glue, Sealant
Trademark:
Radhow
Transport Package:
Carton
Specification:
Customization
Origin:
China
HS Code:
3505200000
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