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Se685 Black Good Thermal Conductivity 2K Epoxy Potting Adhesive for Automotive Electronic Module Video, Demo, How It Works & Features

Published: 2025-04-09 Published by: Shanghai Sepna Chemical Technology Co., Ltd. 295 views 0 comments

Product Specifications

Model NO.:
SE685
CAS No.:
9009-54-5
Formula:
CH3h8n2o
EINECS:
210-898-8
Bonding Function:
Structural Adhesive
Application:
Automobile, Construction
Material:
Epoxy
Color:
Black
Type:
Two-Component
Main Raw Material:
Epoxy Adhesive
Advantage:
High Bond Strength and Sealing
Usage:
Transformer, Electronic Stator, Ignition Coil, etc
OEM/ODM:
Free OEM&ODM Service
Shelf Life:
9 Months
Hardness:
Shore D 85
Flame Retardant Grade:
UL94 V-0
Dielectric Strength:
More Than 17 Kv Per mm
Thermal Conductivity:
1.0
Applications:
Motor, Automotive Electronics, Power Tools
Trademark:
SEPNA
Transport Package:
Air, Sea, Road and Railway.
Specification:
25KG per bucket
Origin:
China
HS Code:
35069900
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